OKAMOTO GDM300晶圆研磨/晶圆抛光减薄机概要：
Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life.A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment.

晶圆研磨/晶圆抛光减薄机GDM300特点：
The process from back grinding to wafer mounting continuously by fully automatic system,
With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
Built in edge trimming system is available as an option for thin wafer process.
Dual index system, which polishing stage and grinding stage is completely separated,
satisfy the cleanness required for TSV and MEMS process.
Less than Ra1? ultra luminance, ultra mirror surface is possible.