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TSXCTZ1B,

TSXCTZ1B

在企业搬迁工作中，原来在包装岗位有两台其他品牌的小型 PLC在使用，分别控制堆垛岗位和封切热缩岗位。目前该型号产品已经被淘汰，而在搬迁后发现，PLC上电无反应，必须要进行更新换代。
　　1　工艺原理
　　本包装设备，完成对本厂建材产品的包装，包装材料使用PE 热缩塑封膜。主要工艺步骤包括：①堆垛;②封切：对塑料膜进行切断和封口;③热缩：使PE膜加热收缩包裹产品。
　　2　方案选型
　　2.1 控制方案设计
　　针对本系统的特点，适合采用集成了IO点的小型PLC。而温度可以单独交给温控表进行控制，速度由变频器进行调节，为了提高系统操作性能，温控表和变频器与PLC进行MODBUS通信，交换数据。同时，PLC通过网线连接至中控室上位机，完成数据采集、显示和必要的操作。
　　2.2 PLC选型及IO表设计
　　根据现场设备汇总需要输入点13个，输出点12个，使用 S7-200 SMART系列的SR40型号CPU并设计IO表。
　　2.3 其它主要电气设备选型
　　另外选择了1台安川V1000变频器和2台山武SDC36温控表分别进行速度和温度的控制，它们都支持通过MODBUS通信协议与 S7-200 SMART进行通信。
　　2.4 确定通讯方案
　　(1)上位机以太网通信方案本工厂使用的上位机为亚控公司生产的组态王上位机组态软件，经过查找发现组态王已经更新了S7-200 SMART的驱动，驱动名称：S7 TCP.DLL，驱动版本：60.1.24.30。
　　(2)MODBUS通讯方案安川V1000变频器和山武SDC36温控表具有非常相似的指令结构，能够方便地接入系统。
　其中读取和写入的功能码分别是03H和10H。
　　3　编程与调试
　　3.1 IO控制程序编程与调试
　　塑封膜包装线中堆垛和封切工序的动作最为复杂，而且各动作也存在着逻辑关系，为了准确执行各封切动作，采用步进控制。其他的只采用普通的逻辑控制即可。
　　3.2 MODBUS通信程序编程与调试

上亿库存，国内外近千个仓库，公司部分产品型号如下，欢迎联系哦~！

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